Shenzhen Titan Micro Electronics Co., Ltd. was established in 2003, is headquartered in Shenzhen Nanshan District high tech Industrial Park North violet information port, day micro is to integrated circuit (IC) design, integrated circuit package, semiconductor packaging and testing equipment manufacturing, industrial marketing characteristics of fully synthetic enterprise. Micro day around customer needs continuous innovation, there are more than 3000 customers in the use of micro integrated circuit products, including data converter, LCD display driver, radio frequency (RF) IC, power management products and other types of sensors and signal processing products. Customers throughout the country, Europe, Southeast Asia and other countries in the region.
China's semiconductor industry is day micro core concern of market strategy, we through to provide from the integrated circuit products developing plan, special packaging and signal processing technology is we help customers products and key factors of the differences, these products are widely used in areas such as industrial automation, intelligent home, networking and consumer electronics market.
Relying on on R & D and comprehensive technical ability, day micro adhere to customer as the center of the strategic, understanding customer needs, to provide customers with comprehensive and efficient integration scheme and services. Companies adhering to the "rigorous innovation core, meticulously" purpose, to create a national integrated circuit industry chain, to the independent research and development of new technology and high quality products to repay society, to promote the development of China's national IC industry, the micro construction to become a world-class integrated circuit enterprises, and common development with customers, to develop the market and achieve a win-win situation.

  厦门天微电子有限公司成立于2010年11月，注册资本3000万人民币，为深圳市天微电子股份有限公司的全资子公司，公司位于厦门翔安区火炬开发区三期，是以集成电路设计、封装、测试、销售为核心业务的高新技术企业，自有厂房1.2万平方米，投资总额约为2亿元人民币。结合深圳市天微电子有限公司强大的芯片设计能力及销售网络，公司不断完善整个生产工艺流程，产品测试、封装外型涵盖：
SOP8\14\16\18\20\24\28\32系列
SSOP24\48系列
TSSOP20\24\28系列
QSOP20\24系列
DIP8\14\16\18\24\32\40系列
LQFP44\48\64\100\128系列
SOT 23\89等系列产品。
凭借着自身扎实过硬的产品质量管控体系及稳步增长的生产能力，厦门天微迎着半导体行业飞速发展的良机